Wedge Functional
Wedge Functional
How To Select The Best Semiconductor Capillary For You
Each small details matters when it comes to semiconductor bonding capillaries. From the capillary hole diameter to T Parameter, a small difference can bring a big impact. Here are a few selection tips that we would like to share with you.
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Wedge Bonding
We provide all kinds of Wedge for Wedge wire bonding equipment to cut wires after the second bonder of the aluminum wires or aluminum ribbon is completed. The design of the Wedge and the selection of the material not only meet the requirements of the customers for the service life, but also meet the needs of the customers on the appearance, depth and width of the wedge marks
It is used in semiconductor chip packaging industry aluminum wire or aluminum strip welding process of bonding equipment. At one end of the steel nozzle, the contact aluminum wire is used for welding. The contact aluminum wire end includes the edge of the joint between the bonding groove and the surface size of the key and groove on the end of the steel nozzle. When welding line process key fit, contacts the bonding grooves can be directly on the aluminium wire end friction extruded aluminum to chip, steel mouth converts electrical energy into mechanical energy, through steel mouth is passed on to the aluminum wire, aluminum wire and the chip intersect welded together. The shape can be based on different applications and can be roughly designed to be aluminum and aluminum
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