Product Selection Method
Product Selection Method
How To Select The Best Semiconductor Capillary For You
Each small details matters when it comes to semiconductor bonding capillaries. From the capillary hole diameter to T Parameter, a small difference can bring a big impact. Here are a few selection tips that we would like to share with you.
Tip 1
Capillary hole diameter selection depends on the wire diameter. Large hole diameter will cause the wire to not be in the centre of the ball (refer to the photo beside) and causing broken neck. If the hole is too small, it will have a tight and uneven curve, causing neck crack and broken neck to happen. The ideal hole diameter is 0.2 to 0.3mils wider than the wire diameter, to ensure the fluency of the wire and minimise the bonding reliability issue.
Tip 2
Capillary hole diameter selection depends on the wire diameter. Large hole diameter will cause the wire to not be in the centre of the ball (refer to the photo beside) and causing broken neck. If the hole is too small, it will have a tight and uneven curve, causing neck crack and broken neck to happen. The ideal hole diameter is 0.2 to 0.3mils wider than the wire diameter, to ensure the fluency of the wire and minimise the bonding reliability issue.
Tip 3
T Parameter will directly affect the bond tail width. Large T parameter will produce wide bond tail and the bond tail become thin at second bond. If T parameter is too small, it will reduce the surface adhesion between wire and bond pad on lead frame. Then, causing low pull test data and break at bond tail.
Tip 4
Normally OR parameter is related to bond neck thickness at second bond. When OR is too big, it will reduce the thickness of bond tail and possibly causing heel crack at second bond.
